Electronic Component Quality Inspection

Our component inspection process embodies our commitment to quality, ensuring that you receive the highest quality electronics components consistently.

We thoroughly examine, assess, and test each electronic component delivery, from external packaging to component analysis, guaranteeing that the electronic components we provide meet the highest quality standards.

Process Traceability at Every Step

Lantek’s quality and inspection processes are meticulously documented in our internal system. Each component is barcoded and tracked through every stage, from supplier delivery to customer dispatch.

These records are accessible to team members worldwide, ensuring a consistent quality approach, standardized operations, and dedicated support for our customers.

Lantek Office

Component Inspection Program

Our experienced team of inspectors adheres to the rigorous procedures specified in the esteemed IDEA-STD-1010 standard for component testing. We are adaptable and can implement specific testing and report on request, following any industry-specific or company protocols required by our customers.

In-house inspection and Extended testing

All components entering our facilities undergo a thorough inspection process upon arrival. Each component is photographed and inspected according to the type of part, age, supply chain, and specific customer requirements. When further testing is necessary after our internal inspections, we collaborate closely with our vetted third-party accredited test houses. This partnership enables us to provide our customers with testing packages tailored to their specific needs.

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Documentation & packaging

Verifies components have proper documentation and compliant packaging.

Scrape test

Scrapes the component's surface to check authenticity and detect for remarking.

Solderability

Assesses component's ability to be soldered correctly ensuring reliable connectioncs.

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Component visual inspection

Examines the components for visible defects or irregularities.

Decapsulation test

Removes outer casing to inspect internal structure for hidden defects.

AC/DC functionality

Operational performance under alternating and direct current conditions.

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Dimensional check

Checks physical dimensions of components to ensure they meet specified tolerances.  

X-ray inspection

Uses X-ray imaging to examine the internal structure of components for defects and authenticity.

Full electrical/key functions

Tests all electrical functions to confirm components meet performance specifications.

Acetone/solvent test

To check for remarking or coating issues by observing any changes or reactions.

XRF test

Utilizes X-ray fluorescence to analyse material composition and verify authenticity.

Scanning mircoscopy

High-resolution microscopy to inspect surface and detect minute defects or forgery.

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Documentation and packaging

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Component visual inspection

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Dimensional check

Acetone/mixed solvent test

Scrape test

Decapsulation analysis

X-ray inspection

XRF test

Solderability

AC/DC functionality

Full electrical/key functions

Scanning microscopy

Lantek Inspection Report

Our detailed inspection report serves as an essential reference for due diligence and risk mitigation. Our testing protocols are in line with AS6081 (Counterfeit Electronic Parts: Avoidance, Detection, Mitigation, and Disposition), including Decapsulation, X-Ray, and XRF.

This comprehensive report offers a standardized and consistent method to verify the authenticity and quality of the components you purchase from us.

Our Global Sourcing Services

From long lead times to changed forecasts, we provide a rapid solution to your electronic component shortages.